Artwork

コンテンツは PCEA によって提供されます。エピソード、グラフィック、ポッドキャストの説明を含むすべてのポッドキャスト コンテンツは、PCEA またはそのポッドキャスト プラットフォーム パートナーによって直接アップロードされ、提供されます。誰かがあなたの著作物をあなたの許可なく使用していると思われる場合は、ここで概説されているプロセスに従うことができますhttps://ja.player.fm/legal
Player FM -ポッドキャストアプリ
Player FMアプリでオフラインにしPlayer FMう!

RM 154: Thermal Profiling Best Practices

1:00:38
 
シェア
 

Manage episode 447452961 series 2989537
コンテンツは PCEA によって提供されます。エピソード、グラフィック、ポッドキャストの説明を含むすべてのポッドキャスト コンテンツは、PCEA またはそのポッドキャスト プラットフォーム パートナーによって直接アップロードされ、提供されます。誰かがあなたの著作物をあなたの許可なく使用していると思われる場合は、ここで概説されているプロセスに従うことができますhttps://ja.player.fm/legal

One of the most critical aspects of manufacturing high-reliability circuit assemblies is thermal profiling during the reflow process.
Whether you're designing, engineering, or troubleshooting circuit assemblies, understanding how temperatures during the reflow process influences the quality and performance of your assemblies is essential.
In this episode, we’ll break down what thermal profiling is, why it’s important, and how it affects everything from solder joint integrity to component placement.
We’ll also explore the challenges and solutions involved in getting your thermal profile just right, ensuring your circuit assemblies are built to last in a competitive and demanding industry. And we review thermal profiling best practices, common mistakes, and the various capabilities of thermal profilers.
Mike Konrad's guest is Mark Waterman. Waterman is the Electronics division manager at ECD, a manufacturer of thermal profiling equipment founded in 1964. He began his career at ECD in 2006.

Chapters:

00:00:00 Understanding Thermal Profiling in Circuit Assemblies

00:05:19 Evolution of a Manufacturing Business

00:08:00 Understanding Thermal Profiling in Electronics Soldering

00:10:36 Strategies for Circuit Assembly Insulation

00:13:10 Challenges in Sourcing Obsolete Electronic Components

00:15:48 Challenges in Heat Dissipation for 5G and 6G Electronics

00:18:54 Choosing the Right Thermocouple: K Type vs. Others

00:21:35 Challenges with High-Temperature Materials

00:24:04 Determining Thermal Couples for Optimal Measurement

00:26:39 Innovations in Profiling Equipment Technology

00:29:24 Innovations in Display Screens and Risk Mitigation

00:31:55 Cost-Benefit Analysis of Data Loggers

00:34:31 Importance of Calibration Intervals in Industry

00:37:02 The Role of Data Logging in Thermal Profiling

00:39:30 Optimizing Reflow Oven Settings with Predictive Software

00:42:18 Easy Button vs. Detailed Work: Software Development Insights

00:45:20 Common Mistakes in Using Thermal Profilers

00:47:37 Optimizing Thermocouple Measurements in Electronics

00:50:08 Understanding Thermal Barriers and Heat Management

00:52:22 Understanding Thermal Dissipation Challenges

00:54:59 The Importance of Third-Party Auditors in Manufacturing

00:57:32 Insights on Thermal Profiling and Bespoke Solutions

00:59:54 Podcast Contact and Closing Remarks

  continue reading

250 つのエピソード

Artwork
iconシェア
 
Manage episode 447452961 series 2989537
コンテンツは PCEA によって提供されます。エピソード、グラフィック、ポッドキャストの説明を含むすべてのポッドキャスト コンテンツは、PCEA またはそのポッドキャスト プラットフォーム パートナーによって直接アップロードされ、提供されます。誰かがあなたの著作物をあなたの許可なく使用していると思われる場合は、ここで概説されているプロセスに従うことができますhttps://ja.player.fm/legal

One of the most critical aspects of manufacturing high-reliability circuit assemblies is thermal profiling during the reflow process.
Whether you're designing, engineering, or troubleshooting circuit assemblies, understanding how temperatures during the reflow process influences the quality and performance of your assemblies is essential.
In this episode, we’ll break down what thermal profiling is, why it’s important, and how it affects everything from solder joint integrity to component placement.
We’ll also explore the challenges and solutions involved in getting your thermal profile just right, ensuring your circuit assemblies are built to last in a competitive and demanding industry. And we review thermal profiling best practices, common mistakes, and the various capabilities of thermal profilers.
Mike Konrad's guest is Mark Waterman. Waterman is the Electronics division manager at ECD, a manufacturer of thermal profiling equipment founded in 1964. He began his career at ECD in 2006.

Chapters:

00:00:00 Understanding Thermal Profiling in Circuit Assemblies

00:05:19 Evolution of a Manufacturing Business

00:08:00 Understanding Thermal Profiling in Electronics Soldering

00:10:36 Strategies for Circuit Assembly Insulation

00:13:10 Challenges in Sourcing Obsolete Electronic Components

00:15:48 Challenges in Heat Dissipation for 5G and 6G Electronics

00:18:54 Choosing the Right Thermocouple: K Type vs. Others

00:21:35 Challenges with High-Temperature Materials

00:24:04 Determining Thermal Couples for Optimal Measurement

00:26:39 Innovations in Profiling Equipment Technology

00:29:24 Innovations in Display Screens and Risk Mitigation

00:31:55 Cost-Benefit Analysis of Data Loggers

00:34:31 Importance of Calibration Intervals in Industry

00:37:02 The Role of Data Logging in Thermal Profiling

00:39:30 Optimizing Reflow Oven Settings with Predictive Software

00:42:18 Easy Button vs. Detailed Work: Software Development Insights

00:45:20 Common Mistakes in Using Thermal Profilers

00:47:37 Optimizing Thermocouple Measurements in Electronics

00:50:08 Understanding Thermal Barriers and Heat Management

00:52:22 Understanding Thermal Dissipation Challenges

00:54:59 The Importance of Third-Party Auditors in Manufacturing

00:57:32 Insights on Thermal Profiling and Bespoke Solutions

00:59:54 Podcast Contact and Closing Remarks

  continue reading

250 つのエピソード

すべてのエピソード

×
 
Loading …

プレーヤーFMへようこそ!

Player FMは今からすぐに楽しめるために高品質のポッドキャストをウェブでスキャンしています。 これは最高のポッドキャストアプリで、Android、iPhone、そしてWebで動作します。 全ての端末で購読を同期するためにサインアップしてください。

 

クイックリファレンスガイド