Live from IMAPS Symposium 2024: Updates on the NAPMP, Silicon Photonics and RDL Packaging

3D InCites Podcast

Send us a text

This episode was recorded live at the IMAPS International Symposium in Boston MA. Françoise von Trapp speaks with Dev Palmer, director of the National Advanced Packaging Manufacturing Program; Sandeep Sane of Lightmatter; Craig Bishop, Deca and Brett Wilkerson, AMD.

Dev Palmer explains Chips Act's funding distribution and its impact on the semiconductor ecosystem. He emphasizes the importance of bridging research and industry and describes some of the programs key initiatives. Palmer highlights the need for collaboration across large and small businesses, academia, and nonprofits to achieve the Chips Act's ambitious goals, and shares the details of the recently announced Small Business Innovation Research (SBIR) program under the Biden Harris administration.

Sandeep Sane, Head of Packaging at LightMatter, discusses the role of 3D optical integration in extreme compute scaling. He highlights the challenges in integrating silicon photonics into chip designs to provide high bandwidth at lower power, essential for AI and data centers. You’ll learn how 3D stacking addresses memory and logic competition on chips; and how chiplet-based architectures improve performance but increase power consumption.

Craig Bishop of DECA and Brett Wilkerson of AMD discuss the evolution and applications of Redistribution Layer (RDL) packaging, particularly in high-performance computing and AI. They also highlightthe role of AI in enhancing packaging design and the future of AI applications, emphasizing the need for both centralized and edge computing to balance performance and power consumption.
Contact The Speakers on LInkedIn

• Dev Palmer, NAPMP
• Sandeep Sane, Lightmatter
• Craig Bishop, Deca
• Brett Wilkerson, AMD

Resources

• For General Inquiries about CHIPS for America [e-mail]
• For CHIPS Incentives Program inquiries [e-mail]
• For Congressional inquiries about CHIPS for America [e-mail]

IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show

Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.